KAOHSIUNG, Oct. 24, 2023 /PRNewswire/ — On September 19, 2023, Intel announced one of the industry’s first glass substrates for next-generation advanced packaging. The industry believes that glass substrates are emerging as a promising alternative interlayer material, especially for heterogeneous packaging such as 2.5D or 3D packages.
As demand for AI, high-speed computing (HPC), and powerful computing continues to grow, there is an increasing need to improve the number of transistors in a single package. However, traditional organic materials such as silicon, commonly used for interposers, encounter limitations. Glass substrates offer numerous advantages, including exceptional flatness, high thermal stability and rigidity. These attributes allow the miniaturization and integration of transistors on a glass substrate.
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Processing glass substrates presents significant challenges, mainly due to their high durability, especially in the context of achieving 2.5D or 3D packaging using the Through-Glass-Via (TGV) technique. This challenge is further complicated by strict precision and size requirements.
“The UPH is the key.
TGV, an essential method for glass substrates to achieve 2.5D/3D packaging, involves internal modification for subsequent wet etching processes. Currently, the most common TGV method uses a filament bundle to generate multiple shots for internal modification, with a VPS of approximately 50 ways per second only. However, E.
E’s TGV Complete Tool Automation Machine
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Reference link: https://www.allaboutcircuits.com/news/intel-develops-glass-substrate-for-next-generation-advanced-chip-packaging-needs/
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