-REVASUM (ASX: RVS) obtains a letter of intent to purchase a 6EZ silicon carbide CMP system from SENIC, a leading silicon carbide substrate manufacturing technology company in Cheonan, South Korea

SAN LUIS OBISPO, Calif., July 28, 2023 /PRNewswire/ — This planned purchase, which will ship to Senic in Q4 2023, reinforces 6EZ’s position as the most flexible CMP platform. available to support the fabrication of silicon carbide (SiC) substrates and the fabrication of devices such as SiC-based MOSFETs.

The recent release of the 6EZ 200mm conversion kit will allow the tool to be compatible with manufacturing 150mm and 200mm SiC substrates at Senic’s facility in Cheonan, South Korea.

The 6EZ CMP system was developed with Revasum’s 7AF-HMG SiC grinder to eliminate subsurface damage from the grinding process. The 6EZ provides minimal TTV on the wafer and RA on the order of 1.5 Angstroms.

Commenting on the development of the partnership with this strategic customer in South Korea, Chris Sloan, Revasum’s vice president of worldwide sales and marketing, said: “This is an important next step for Revasum in the truly global landscape of substrate manufacturing. of silicon carbide. Demand for Silicon Carbide Devices is forcing international supply chains to align to support the effort, and with our industry-leading 6EZ CMP platform, we are excited to partner with Senic’s innovative team.” .

J.D. Seo, Vice President of Senic’s Wafer Business Division, said: “We believe this partnership will create positive synergy between the two companies and through Revasum’s 6EZ CMP system, Senic will be able to provide SiC wafers with better surface quality. to its customers. Since the 6EZ has already proven itself in the manufacture of silicon carbide substrates, we believe the 6EZ system is the best fit for Senic as we scale up our production to meet the demands of the global industry.”

About Revasum, Inc.:Revasum ( https://www.revasum.com) manufactures capital equipment used in semiconductor manufacturing. Our current product portfolio includes chemical mechanical grinding and polishing equipment used to manufacture silicon carbide substrates and devices for the global semiconductor industry.

About SENIC, Inc.:SENIC ( http://www.senic.co.kr) is a global innovator in silicon carbide wafer manufacturing headquartered in Cheonan, South Korea. The company provides 150mm and 200mm silicon carbide (SiC) ingots and substrates for RF and power electronics, as well as SiC wafer salvage service.

Media Contact:Bruce Raybruce.ray@revasum.com

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