– REVASUM (ASX:RVS) announces the release of a 200mm conversion kit for its flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) deck
SAN LUIS OBISPO, California, July 6, 2023 /PRNewswire/ — Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its worth in high volume manufacturing of 150mm SiC substrates, and now a 200mm conversion kit has been tested and released, giving customers the option to upgrade 6EZ systems over the land.
Dr Fred Sun, Vice President of R&D and Process Technologies at Revasum, stated: “Although the 6EZ was designed from the outset to polish 200mm substrates, due to the scarcity of these larger substrates on the market, we had not been able to fully characterize polishing performance on 200mm substrates until recently.The tool worked amazingly well on 200mm wafers: we achieved the same PV (pressure x velocity) operating range that we had previously observed on 150mm SiC wafers, even doubling the polished surface”.
The 6EZ is the first wafer CMP tool designed from the ground up for SiC wafer polishing. The architecture of the 6EZ, along with proprietary cooling technology, allows for higher downforce and table speeds preferred for CMPing of hard materials like SiC. The patented design of the ViPRR carrier secures the wafer while minimizing polishing friction on the pad to enable less pad conditioning, better wafer-to-wafer consistency, and longer consumable life.
Scott Jewler, CEO of Revasum, commented: “We believe that polishing premium SiC wafers requires a different approach to head design than conventional membrane-based heads. The polishing head must hold the wafer in position while applying controlled pressure to the back of the wafer to produce a consistently high removal rate with good thermal management.We are very pleased with the results achieved with the 6EZ on 200mm SiC wafers and I think our customers are too They will appreciate the ease of maintenance of the tool in a high volume production environment with wafers of this size.”
About Revasum, Inc.: Revasum specializes in the design and manufacture of capital goods used in the semiconductor device and substrate manufacturing process. Our current product portfolio includes the 7AF-HMG grinder and CMP 6EZ platform used for fabrication of silicon carbide substrates up to 200mm and packaging of SiC-based devices for the global semiconductor industry.
CONTACT: Bruce Ray, bruce.ray@revasum.com
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