SAN LUIS OBISPO, California, July 12, 2023/PRNewswire/ — Revasum today announced the release of system control software enhancements for its flagship silicon carbide CMP tool, 6EZ, that increase system performance up to by 20% or more. Performance enhancements are included in our latest SW 3.1 release and include a number of enhancements to the 6EZ wafer handling control software. The upgrade was successfully deployed to existing 6EZ production systems in the factories of several Tier 1 customers. This software significantly reduces the cost of ownership of 6EZ per wafer for our customers.
“The wafer handling control software in earlier versions of the 6EZ software included wafer handling motions that were optimized for some of the early SiC polishing recipes, but placed unnecessary restrictions on production recipes currently carried out by our By removing these restrictions and implementing other improvements to wafer handling, we were able to significantly increase tool performance without any negative impact on tool reliability.We have also ensured that these improvements do not change the excellent process results production recipes currently used by our customers,” said Bill Kalenian, vice president of engineering at Revasum.
“Since we achieved our initial goals of demonstrating reliable, high-volume operations and high-quality, repeatable polishing results on hard SiC substrates, the time was right for Revasum to enable increased productivity for our customers as job volumes increase. wafers. SW 3.1 enables a significant increase in productivity and has a number of other new features that will improve the flexibility and reliability of the 6EZ in high-volume production,” said Scott Jewler, CEO of Revasum. “Version 3.1 of the software has been installed and released to production at several leading SiC substrate customers and will ship installed on future orders.”
About Revasum, Inc.:
Revasum specializes in the design and manufacture of grinding and polishing equipment for semiconductor manufacturing. Revasum has leveraged its significant intellectual property portfolio to develop two flagship products designed from the ground up for silicon carbide. The new products can be configured for SiC wafer sizes up to 200mm.
Media Contact:Bruce Raybruce.ray@revasum.com
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